Reactive magnetron sputtering is a widely used deposition technique in different application areas. In this study its use is evaluated for the deposition of metal thin films (Al, Cu and Ti) and oxide thin films (Al2O3, TiOx) on woven and nonwoven substrates. The study shows that good adhesion can only be achieved when the substrate is pre-treated in a glow discharge. The influence of the substrate on the reflectivity of Al and Cu thin films was investigated. For conductive textile applications, the resistivity of metal thin films and TiOx was investigated.
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