The interaction of pure zinc and Zn–4Al, Zn–15Al (wt-%) solder alloys with aluminium has been investigated. Two different experimental techniques were used: (i) the aluminium samples soldering and (ii) the holding of liquid solder alloys inside the hollow in an aluminium base. The aluminium content was determined in samples after contact with aluminium at various temperatures and various holding times. It is shown that in soldered seams and solder alloys that had been held inside the aluminium base, the content of the aluminium was higher than at the points on the liquidus line on the Zn–Al equilibrium phase diagram at the corresponding temperatures and increases along with an increase in the holding time. This was apparently due to isothermal solidification.
ZengG., McDonaldS. and NogitaK.: ‘Development of high-temperature solders: review’, Microelectron. Reliab., 2012, 52, 1306–1322. doi: 10.1016/j.microrel.2012.02.018
2.
NagaokaT., MorisadaY., FukusumiM. and TakemotoT.: ‘Selection of soldering temperature for ultrasonic-assisted soldering of 5056 aluminum alloy using Zn–Al system solders’, J. Mater. Process. Technol., 2011, 211, 1534–1539. doi: 10.1016/j.jmatprotec.2011.04.004
XiaoY., JiH., LiM., KimJ. and KimH.: ‘Microstructure and joint properties of ultrasonically brazed Al alloy joints using a Zn–Al hypereutectic filler metal’, Mater. Des., 2013, 47, 717–724. doi: 10.1016/j.matdes.2013.01.004
5.
PstrusJ., FimaP. and GancarzT.: ‘Wetting of Cu and Al by Sn–Zn and Zn–Al eutectic alloys’, J. Mater. Eng. Perform., 2012, 21, 606–613. doi: 10.1007/s11665-012-0174-7
6.
MovahediM., KokabiA. H. and Madaah HosseiniH. R.: ‘An investigation on the soldering of Al 3003/Zn sheets’, Mater. Charact., 2009, 60, 441–446. doi: 10.1016/j.matchar.2008.11.010
7.
Abou El-khairM. T., DaoudA. and IsmailA.: ‘Effect of different Al contents on the microstructure, tensile and wear properties of Zn-based alloy’, Mater. Lett., 2004, 58, 1754–1760. doi: 10.1016/j.matlet.2003.10.058
8.
PolaA., RobertiR. and MontesanoL.: ‘New zinc alloys for semisolid applications’, Int. J. Mater. Form., 2010, 3, 743–746. doi: 10.1007/s12289-010-0877-y
9.
TakakuY., FeliciaL., OhnumaI., KainumaR. and IshidaK.: ‘Interfacial reaction between Cu substrates and Zn–Al base high-temperature Pb-free solders’, J. Electron. Mater., 2008, 37, (3), 314–323. doi: 10.1007/s11664-007-0344-9
10.
TakakuY., MakinoK., WatanabeK., OhnumaI., KainumaR., YamadaY., YagiY., NakagawaI., AtsumiT. and IshidaK.: ‘Interfacial reaction between Zn–Al-based high-temperature solders and Ni substrate’, J. Electron. Mater., 2009, 38, (1), 54–60. doi: 10.1007/s11664-008-0528-y
11.
PashkovI. N., BazhenovV. E., BazlovaT. A. and AnohinA.: ‘Physical modelling of brazed joint structure forming under non-equilibrium solidification conditions’ ‘Brazing, high temperature brazing and diffusion bonding LÖT’, Düsseldorf, DVS Media GmbH223–225; 2013.
12.
CookG. O.III and SorensenC. D.: ‘Overview of transient liquid phase and partial transient liquid phase bonding’, J. Mater. Sci., 2011, 46, 5305–5323. doi: 10.1007/s10853-011-5561-1
13.
MacDonaldW. D. and EagarT. W.: ‘Transient liquid phase bonding’, Annu. Rev. Mater. Sci., 1992, 22, 23–46. doi: 10.1146/annurev.ms.22.080192.000323
14.
ScheilE.: ‘Bemerkungen zur Schichtkristallbildung’, Z. Metallkd., 1942, 34, 70–72.
15.
ChenQ. and SundmanB.: ‘Computation of partial equilibrium solidification with complete interstitial and negligible substitutional solute back diffusion’, Mater. Trans., 2002, 43, (3), 551–559. doi: 10.2320/matertrans.43.551
16.
TurriffD. M., CorbinS. F. and KozdrasM.: ‘Diffusional solidification phenomena in clad aluminum automotive braze sheet’, Acta Mater., 2010, 58, 1332–1341. doi: 10.1016/j.actamat.2009.10.037
17.
FujikawaS. -I., HiranoK. -I. and FukushimaY.: ‘Diffusion of silicon in aluminum’, Metall. Trans. A, 1978, 9A, 1811–1815. doi: 10.1007/BF02663412
18.
HisayukiK., YamaneT., TakahashiT., MinaminoY., HiraoK. and ArakiH.: ‘Diffusion of zinc in commercial Al–Zn alloys under high pressure’, J. Mater. Sci., 1999, 34, 2449–2454. doi: 10.1023/A:1004575002418
19.
WangX. G., LiX. G. and YanQ.: ‘Effect of two step heating process on joint microstructure and properties during transient liquid phase bonding’, Sci. Technol. Weld. Join., 2007, 12, (5), 455–459. doi: 10.1179/174329307X213891
20.
WangX. G., LiX. G. and WangC. G.: ‘Transient liquid phase bonding of aluminium alloy using two-step heating process’, Sci. Technol. Weld. Join., 2012, 17, (5), 414–418. doi: 10.1179/1362171812Y.0000000026
21.
WangX., LiX. and WangC.: ‘Effect of two-step heating process on joint microstructure and properties during transient liquid phase bonding of dissimilar materials’, Mater. Sci. Eng. A, 2013, A560, 711–716. doi: 10.1016/j.msea.2012.10.018
22.
AssadiH., ShirzadiA. A. and WallachE. R.: ‘Transient liquid phase diffusion bonding under a temperature gradient: modelling of the interface morphology’, Acta Mater., 2001, 49, 31–39. doi: 10.1016/S1359-6454(00)00307-4
