Abstract
A simple new preparation method for silver surface-enhanced Raman scattering (SERS) substrate (Ag/Cu film) was developed by reduction of aqueous Ag+ on copper foil, which is used for making print circuit board. The properties of the substrate were evaluated. The approximate limit of detection (LOD) was measured using 2,2′-bipyridine (bpy) and 1,1′-diethyl-trimethincyanine dye (TMC) as probing compounds. The LOD of bpy and TMC are 1 nanomole and 0.13 nanomole, respectively. The film-to-film reproducibility is comparable to the nitric acid etched silver foil SERS substrate. The surface morphology of the Ag/Cu film was observed by scanning electron micrography. The high SERS sensitivity of the film may be attributed to its special surface structure.
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